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Titel des Beitrags Design, Setup and Test of a Heterogeneous Module and Characterization by Stress Measurement
Erscheinungsjahr 2015 Publikations-Art Wissenschaftlicher Vortrag Name der Konferenz/Veranstaltung Deutsche IMAPS-Konferenz 2015
Tagungsort Friedrichshafen Tagungsdatum 15.09.2015 Berichtsjahr 2015
Abstract : This paper presents design, setup and test of a heterogeneous antenna tuner module and its characterization by stress measurements. Key features provided for this integration platform are a small module size in combination with a low module height, a good RF performance, good heat dissipation capabilities, high electrical and thermo-mechanical reliability also supporting the low pressure encapsulation of MEMS cavity packages, a compatibility with a small pitch (150 µm) of the devices to be assembled, and high cost efficiency.
Based on multi-layer substrates, modules have been designed to develop a low pressure molding process (max. pressure of 30 bar) and to integrate a fine pitch flip chip technology (max. pitch of 150 µm). Whereas encapsulation with a transfer molding process at pressures below 25 bar did not show promising results, especially with respect to reliability issues due to insufficient underfilling of the assembled components, a newly developed compression molding process shows good results and full compatibility with the cavity packages for MEMS devices.
The molding process development was supported by stress measurements utilizing special stress measurement chips mounted on the module by diebonding and wire bonding process. With this method the stress distribution after the molding process and due to reliability testing could be monitored and both process and design optimization could be done to avoid stress peaks as well as to guarantee a sufficient underfilling of the assembled components.
Einrichtungen Fakultät Maschinenbau
Beteiligte Personen Schreier-Alt , Thomas Prof.
Projekte Wissenschaftliche Veröffentlichungen